According to Yole Group's recently released new "Power Silicon Carbide - Device Market and Technology Trend Analysis Report", the silicon carbide market is growing rapidly, attracting a large amount of investment. Capex in the SiC market will peak in 2026, while SiC device revenue is likely to exceed overall capex in 2027. This trend reflects the strong growth momentum of the silicon carbide market and the continued demand for investment. 

From June 26th to 27th, the 5th Generation 3rd Generation Semiconductor Conference will be held in Hall 6 of Shenzhen World Convention and Exhibition Center (Bao'an New Hall) based on the strong foundation of the 6th Shenzhen International Semiconductor Exhibition (60,000 square meters, 800+ exhibitors, and 60,000+ expected visitors). At that time, it will bring together authoritative experts from the field of third-generation semiconductors, specific representative head enterprises, research institutions, and industry elites in the silicon carbide and gallium nitride industry chains. 

June 26-27 All day

Forum Area 6 of Shenzhen World Exhibition & Convention Center

There will be a brainstorming summit

SEMI-e 2024 The 5th Generation Semiconductor Industry Development Summit Forum

The forum will be divided into four hot topics: SiC and GaN

The specific agenda and guest lineup 

01

Agenda and guest introductions 

 

Topic 1: Advanced Packaging and Testing Technology and Process Sharing June 27, 10:00-12:00 a.m

compere

Inner Mongolia Jinghang Special Carbon Technology Co., Ltd 

Mr. Li Xueguang

When: June 26 

Belgium foundry - BelGaN

Dr. Zhenhong Zhou, CEO

Presentation time: 10:00-10:20

Topic: Global SiC and GaN Industry Ecosystem Competition Pattern and Future Development 

Innoscience (Shenzhen) Semiconductor Co., Ltd

Xie Wenbin, Senior Chief Engineer of Product Application

Presentation time: 10:20-10:40

Topic: Key Factors for Large-Scale Application of GaN 

Zhuhai Gallium Future Technology Co., Ltd

Zhang Dajiang R&D Director

Presentation time: 10:40-11:00

Topic: The Future Has ---- Development of GaN Devices in High-Power Applications 

Shaanxi Yuteng Electronic Technology Co., Ltd

Lin Liteng General Manager

Presentation time: 11:00-11:20

Topic: Introduction to GaN Epicrystals 

Shandong Jinggallium Semiconductor Co., Ltd

Wang Shouzhi General Manager

Presentation time: 11:20-11:40

Topic: Growth and Processing of GaN Crystals 

Fuzhou Gallium Valley Semiconductor Co., Ltd

Dr. Liang Hu is the General Manager/CTO/Chief Scientist

Time: 11:40-12:00

Topic: Introduction to GaN Power Electronics Applications and Epitaxial Technology 

 

Topic 2: SiC Technology Status and Market Trend Analysis 13:40-16:20 p.m. on June 26

Beijing Tianke Heda Semiconductor Co.

Guo Yu Technical Director

Speaking time: 13:40-14:00

Topic: Progress and Challenges of High Quality 4H-SiC Substrate and Epitaxial Materials 

Shanxi Scintech Crystal Co.

Ma Kangfu Assistant General Manager

Time：14:00-14:20

Speech Topic: “Development Status and Thoughts on Large-Size Silicon Carbide Single-Crystal Substrate 

Harbin Keyou Semiconductor Industry Equipment and Technology Research Institute Co.

Dr. Shengtao Zhang, R&D Technology Director

Time: 14:20-14:40

Speech Topic: “Industrialization Progress of Keyou's 8-inch Silicon Carbide Substrate”. 

Jiangsu Jixin Advanced Materials Co.

Dr. Guan Chunyang, Director and Executive President

Time: 14:40-15:00

Topic：“SiC Substrate Wafer Size Development Trend and the Study of Significant Cost Reduction Direction at this Stage”. 

AIXTRON

Mr. Fang Ziwen, General Manager

Time：15:00-15:20

Speech Topic: “Compound Semiconductor Epitaxial Large Scale Mass Production Solution”. 

Hebei Puxing Electronic Technology Co.

Zhang Yongqiang Product Director

Time: 15:20-15:40

Topic：“Large Diameter Silicon Carbide Epitaxy Technology and Progress”. 

Dalian Chuangrui Spectrum Technology Co.

Yuzhong Chen CEO

Time：15:40-16:00

Topic: “Defect Detection of Sic Substrate and Epitaxial Wafers”. 

Topic 3: The Dirty Core of New Energy Industry, Current Situation and Analysis of China's Vehicle Specification Power Device Market June 27, 10:00-11:00am 

Moderator: Guangzhou Yue Sheng Semiconductor Equipment Co. 

Guangzhou Yue Sheng Semiconductor Equipment Co.

Ms. Li Jinghui

Hosted by: June 27 

Nano Semiconductor

Zhu Jin Senior Technical Marketing Manager

Speech Time: 10:00-10:20  

Speech Topic: “Nano Semiconductor GaN & SiC Opens a New Chapter of Automotive Power Design 

Guangdong Zhineng Technology Co.

Co-Founder Dr. Wang Lechi

Speaking Time: 10:40-11:00

Topic：Application Defined Devices, Market Driven Progress, GaN for Innovation 

Shenzhen Basic Semiconductor Co.

Mr. Cai Xiongfei, Deputy General Manager

Time：11:00-11:00

Speech Topic: Advances in Automotive Grade Power Semiconductors 

Topic IV: Exploring New Semiconductor (GaN/SiC) Material Preparation June 27, 14:00-15:40 PM 

Qingdao High-Test Technology Co.

Yu Yapeng, Industry Solution Manager

Time: 14:00-14:20

Speech Topic: “Diamond Wire Cutting Technology in Semiconductor Industry Application and Development 

China Electronics Technology Group Corporation 45th Research Institute

Song Wenchao, Deputy Director of Semiconductor Cleaning Equipment Division

Time: 14:20-14:40

Speech Topic: “Research on Domestic Semiconductor Wet Process Equipment 

Beijing Beifang Huachuang Microelectronics Equipment Co.

Deputy General Manager of Compound Semiconductor Industry Development Department Lv Chunxue

Speech time: 14:40-15:00

Topic：Demand Leadership, Technological Innovation, Building a New Ecology for China's Silicon Carbide Industry 

Beijing Jingyi Precision Micro Technology Co.

Cai Changyi, Senior Director of R&D Laboratory

Time: 15:00-15:20

Topic："Silicon Carbide Substrate ECMP Solution 

Zhejiang Bolainarun Electronic Materials Co.

Mr. Zhang Zefang, Chairman

Time: 15:20-15:40

Speech topic：“Silicon Carbide CMP material overall solution”. 

Dongguan Crest Technology Co.

Mr. Mei Lingliang, General Manager

Time: 15:40-16:00

Speech Topic: Application of Water-guided Laser in Micro-precision Processing of Semiconductor Materials 

02

 Attendee List    

New Energy Vehicle Factory

Vice President of National New Energy Vehicle Technology Innovation Center   

Deputy Secretary General, China Automotive Chip Industry Innovation Strategy Alliance

China Automotive Chip Standard Testing and Certification Alliance   

Deputy Secretary General

Guangzhou Automobile Research Institute   

Chief Engineer of In-vehicle Software Specialization, Academy-level Expert

Huawei Cloud   

Automotive Industry Solution Expert

FAW  

Engineer

Geely Technology Group/Excellence BU   

Vice President

Geely College of Intelligent Network and New Energy Vehicles   

Associate Professor

Xiaomi Automobile Co.   

R&D Engineer

Skyworth Automotive Group Co.   

Assistant to Vice Chairman

XPT Azure Drive Technology  

Engineer

BYD Auto Co.   

Others (please add)

SAIC-Volkswagen Automotive Co.   

Engineer-in-Charge

Great Wall Motor Co.   

Product R&D

Hesse Semiconductor   

Engineer

Huawei Technologies Co.   

Quality Engineer

Chery Shanghai R&D Center   

Engineer-in-Charge

Bao Neng New Energy Vehicle   

Data Management Department

Toyota   

First Technical Division

RISO AUTOMOTIVE   

Senior Product Engineer

CSR Zhuzhou Electric Locomotive Research Institute Co.   

Material Engineer

Xiaomi Automobile

Resource Development Engineer  

Xiaomi Automobile   

Resource Development Manager   

Xiaomi Automobile   

Resource Development Senior Manager   

Xiaomi Automobile   

Deputy Director of Resource Development  

Geely Power Research Institute   

Planning Director   

Geely Power Research Institute   

Engineer-in-Charge   

China First Automobile Group Corporation   

Project Manager 

Optical storage and charging/vehicle converter/inverter, etc.

Sunny Power Co.   

Device Technology Senior Engineer

Sunny Power Supply Co.   

Supervisor

Huawei Terminal   

Senior Procurement Manager

Ningde Times   

Engineer

Glory   

Project Manager

Etsy

Shenzhen Shenghong Electric Co.   

Marketing Director

Yingjie Electric

Xinrui Technology

Zhejiang Benyixin Energy

Shangneng Electric Co.   

R&D Engineer

Goodway  

Team Leader

Jinlang Technology Co.   

R&D Supervisor

TBEA   

Engineer

Great Wall Intelligent New Energy   

Quality Engineer

BorgWarner (China) Investment Co.   

Quality Engineer

Bosch   

R&D Engineer

Starr Semiconductor Co.   

Chief Engineer Office

Shanghai Meckerson Energy Storage Technology Co.   

Assistant Engineer

Wisepac Information Technology Co.   

Director

Delta Electronics   

Director

Shengnengjie Technology Shenzhen Co.   

Chief Engineer

Ashwin New Energy Technology (Jiangsu) Co.   

Sales Manager

Jinlang Technology Co.   

Scientific researcher

Hangzhou Womai Power Electronics Co.  

R&D Engineer

Yuneng Technology   

Marketing Manager  

Tianmu Photovoltaic Technology Co.   

Director Engineer

Shenghong Electric Co.   

Engineering Department

Sunwind Electric Co.   

Production Engineering

Megger Energy Technology Co.   

Key Account Marketing Manager

Shangneng Electric Co.   

Engineer

Inventec Electric Co.   

Senior Engineer

Benyixin Energy Zhejiang Co.   

Project Manager

Siemens   

Senior Engineer

New Ai Electric Technology Co.   

Project Manager

Lead-Charge New Energy Technology Co.   

Project Manager

AVIC Teck (Xiamen) Power Technology Co.   

Project Manager

Shenghong Aisuna Xi'an Branch   

Managing Director

Chemax New Energy Technology Co.  

Director

Dillon Power   

Engineer

Sanan Optical Communication Technology Co.   

Director of Optical Technology R&D Department

Fujian SCUD Power Technology Co.   

Director

Silicon Mitus   

Technical Sales Director

Shenzhen Silicon Haida Technology Co.   

Manager

Shenzhen Yuxi New Energy Co.   

Executive Vice President

Shenzhen Huajie Zhitong Technology Co.   

Supply Chain Director

Pigweed Micro (Shenzhen) Electronics Co.   

Chief Executive Officer

Shenzhen Yuxi New Energy Co.   

Executive Vice President

IGBT/Power Devices

ON Semiconductor